The low-temperature selective epitaxial platform developed by ANAME has achieved a series of breakthrough innovations in manufacturing, energy consumption, and production efficiency, and has become the third type of epitaxial equipment in terms of heating lamp design in the world. This equipment can be used for silicon based homogeneous and heterogeneous epitaxial growth on 8/12 inch logic, memory, and epitaxial wafers. The loadlock of the equipment adopts a double-layer design, which takes into account both wafer loading/unloading and cooling; The innovative pre-treatment system design can achieve high-quality surface treatment while minimizing substrate damage; The wafer handling system is able to realize significant throughput improvement by optimizing the grabbing, placement, lift and temperature control of the wafer. The platform can be configured with a total of 2 pre-treatment and 4 EPI process chambers, which can fully meet the production requirements of mainstream foundries.

BAT 300 is the first mass production ALD equipment designed by Aname. This series can simultaneously deposit on 300 pieces 4” wafers or 200 pieces 6” wafers, which greatly increases throughput and reduces running cost.

Advance Cluster Tura Series is Aname’s key cluster-type ALD equipment for advance integrated-circuit processes, mainly used in production of logic and memory devices on 12” wafers. It realizes seamless integration between thermal and plasma-enhanced processes.

platform is developed for customers running mass production in 8” and below of compound semiconductor fields. It is an integrated system with up to 10 process chambers, vacuum transfer chamber, 2 cooling stations and 2 loadloacks.

Grace Mx series is Aname’s first generation of multi-layer compartment ALD equipment. The unique modular design and pre-drive gas delivery system help achieve high process stability. It can process a wide range of oxide and metal materials.

EM3 is the world’s first invention of three-layer structure TH ALD equipment that can process three 12” wafers based on infrared heating, with process temperature up to 600oC. It is mainly used for deposition of thin films such as metals and high-temperature oxides.

Elegant II YE300HL is specially designed for high-end research and development needs. It integrates a number of advanced vacuum interconnect technologies. These innovative features greatly improve R&D efficiency and experimental accuracy.

Elegant Dual XY200 is an ALD equipment specifically designed for university research and corporate scientific endeavors. The unique XY-axis loading design allows separate chambers for oxide, nitride, fluoride deposition, eliminating cross-contamination.

Elegant II-A series is Aname’s mature batch-type ALD equipment. This equipment comes with a loading and transfer system that is capable of handling 25 (8” and below) pieces of wafers in a cassette and is therefore suitable for mass production.

Elegant II-Y series, with a modulated system and dual-hot chamber design, is Aname’s second generation ALD equipment. It mainly targets universities, research institutes and mini batch production customers.