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Atomic Nano-Materials and Equipment Co.,Ltd
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Cluster Series

ANAME’s cluster ALD is a key thin film deposition equipment for advanced integrated circuit technology built on our proprietary Elegant Cluster platform. It is mainly used in the production of 8/12 inch logic, memory devices and can meet various thin film deposition needs such as oxides, nitrides, and metals. This equipment achieves seamless connection between PE and thermal processes, greatly improving process stability and production efficiency. Among them, the thermal ALD process chamber is equipped with plasma self-cleaning function, which helps improve equipment reliability and lengthen the PM cycles, further enhancing performance and competitiveness. The various specifications of this platform have reached the international advanced level and have been recognized by multiple customers.
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Specifications

●    Wafer size: 8/12 inch, customizable

●     Process model: PE, Thermal

●    Loading capacity: single wafer/chamber, max 10 chambers

●    Process temperature: room temperature~500°C

●    Precursor lines: max 6 independent lines per chamber

●    Compatible processes: oxides like AlO、HfO、AIN、TiIN、SiN、Ru、Co, nitrides and metals

●    Application field: Advanced IC, memory and wafer fabrication

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