Elegant Dual XY200 Series
The vacuum transfer system ensures a completely automated transfer process with zero manual intervention, avoiding frequent vacuum breaks in the reaction chamber, thereby enhancing process stability and chamber lifetime. It can be equipped with high performance plasma generator, enabling both thermal and plasma-enhanced deposition processes in the same system without the need of hardware changes, This XY chamber arrangement provides more precise sequential process control, eg. nitride deposition followed by oxide deposition. Wafer size can be 12” and below. Process temperature range from RT to 500oC. Upgradable components include turbo pump, up to 6 independent precursor lines, precursor heating (RT to 300℃) and higher temperature modules, etc.
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Manager Zhang 13815424556
13815424556Manager Zhang (North China, Northwest China, Northeast China)
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