Batch 25 TALD Series
Wafer size can be 12” backward compatible, process temperature from RT to 500oC, processing capacity 25pc/chamber, optional loadlock chamber, maximum 4 independent precursor lines, equipped with ozone generator. It provides a new solution to the production capacity and uniformity problems of thin film deposition, which is suitable for mass production in many fields such as advanced packaging, photovoltaic, MEMs, compound semiconductor, etc.
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13815424556Manager Zhang (North China, Northwest China, Northeast China)
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