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Advanced Cluster Tura 12” Single-wafer ALD Series
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Advanced Cluster Tura 12” Single-wafer ALD Series

Advance Cluster Tura Series is Aname’s key cluster-type ALD equipment for advance integrated-circuit processes, mainly used in production of logic and memory devices on 12” wafers. It realizes seamless integration between thermal and plasma-enhanced processes.
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The thermal ALD process chamber is equipped with self-cleaning function using ICP plasma, which helps improve the equipment reliability and reduce PM frequency, further enhancing its performance and competitiveness. It can be equipped with 1-6 single-wafer process chambers. Process temperature range from RT to 500oC. Upgradable components include up to 6 independent precursor lines, precursor heating (RT to 300oC) and higher temperature modules, etc. ALD materials that can be deposited include oxides, nitrides, metals such as SiO2, SnO2, HfO2, Al2O3, AlN, SiN, TiN, Ru, Co, HZO, etc.

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Telephone: +025-58277112
Sales Telephone: Manager Pan 15655060066
                            Manager Zhang 13815424556
13815424556Manager Zhang (North China, Northwest China, Northeast China)
Overseas Business Department Tel: Manager 17721046096 Wang
After-sales service telephone: Manager 15850767261 Ni
Address: 22nd and 25th floors, Building B, Qingyun Building, No. 266, Puyun Road, Jiangbei New District, Nanjing

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