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Advanced Cluster Tura EM3 TH ALD Series
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Advanced Cluster Tura EM3 TH ALD Series

EM3 is the world’s first invention of three-layer structure TH ALD equipment that can process three 12” wafers based on infrared heating, with process temperature up to 600oC. It is mainly used for deposition of thin films such as metals and high-temperature oxides.
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EM3 features high quality chamber materials, an innovative heating system and a unique chamber design, a breakthrough achievement in advance process equipment for integrated circuit. The wafer temperature capability of up to 600oC has the ability to achieve rapid thermal annealing at 600oC, for the purpose of crystallinity improvement, film densification, stress relaxation etc. The system can be configured with 1-6 process chambers that comes with optional electrostatic chuck and wafer rotation capability. It is equipped with pre-processing and chamber cleaning functions. This system can simultaneously run a maximum total of 18 wafers, making it the highest throughput among the present single-wafer TH ALD equipment in the world.

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Telephone: +025-58277112
Sales Telephone: Manager Hu 13916235350
                            Manager Zhang 13815424556
13815424556Manager Zhang (North China, Northwest China, Northeast China)
Overseas Business Department Tel: Manager 17721046096 Wang
After-sales service telephone: Manager 15850767261 Ni
Address: 22nd and 25th floors, Building B, Qingyun Building, No. 266, Puyun Road, Jiangbei New District, Nanjing

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