PC10 ALD configured with Aname’s Flura
PC10’s wafer transfer system and process chambers effectively control oxygen content in nitride films using high speed turbo-molecular pumps. The uniquely designed process chamber and plasma treatment technology not only guarantees temperature and gas flow uniformity, but also reduces localized film damage due high-energy ions. An integrated weight lifting system also greatly reduces the time of system assembly, troubleshooting, repair and maintenance. The platform can be equipped with 8 PE-ALD chambers and 2 BAT25 TH-ALD chambers, currently one of the highest throughput equipment that exist for 8” compound semiconductor production.
Highlights:
•Step coverage:>95%
•Particle:<10 @ 0.2μm
•Uniformity:<1% @ 8inch EE 10mm
•Maximum capacity:50 pcs 8 inch wafer
•Throughput:> 28WPH (@10nm AlN 8pc)
•Number of process chambers:Max 10 (PE)
•Process:compound semiconductor, MEMS
•Material:AlN, Al2O3, TiN
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Telephone: +025-58277112
Sales Telephone: Manager Hu 13916235350
Manager Zhang 13815424556
13815424556Manager Zhang (North China, Northwest China, Northeast China)
Overseas Business Department Tel: Manager 17721046096 Wang
After-sales service telephone: Manager 15850767261 Ni
Address: 22nd and 25th floors, Building B, Qingyun Building, No. 266, Puyun Road, Jiangbei New District, Nanjing
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