Product Highlights

• The transmission chamber can accommodate 6-10 process chambers allowing for free combination of PE and Thermal processes

• Thermal ALD process chamber configuration with plasma cleaning function

• Thermal ALD process chamber can achieve single batch production process

• ALD process cavity switchable for MLD process

• The self-developed software control system seamlessly integrates with SEMI standard protocol or user specific protocol

• Can be applied to advanced CMOS gate stack deposition of dielectric and metal layers

• Integrate ALD and PVD as well as ALD and CVD technologies to optimize tungsten filling processes and achieve smaller contact resistance

• Complies with SEMI standards

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