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Flura PC-10 series

Product Highlights
  • Integrate 8-10 process chambers
  • The independently developed VTM transmission system is equipped with two cooling stations to simultaneously cool 5 wafers
  • Configure 2loadlocks (25pcs/loadlocks) with built-in self-cleaning function to ensure wafer cleanliness
  • The low background pressure of the process chamber greatly controls the oxygen content of the nitride film layer
  • Unique plasma treatment technology can effectively reduce the impact of high-energy particles on local film layers
  • Unique process chamber design ensures good temperature and flow field damage
  • Convenient maintenance with built-in lifting system greatly reduces system assembly inspection and maintenance time
Specifications
  • Wafer size 6-8 inches
    Film installation ability 1 piece/cavity configuration 8-10 process cavities
    Applicable process AlN、TiN、Al2O3
    Application Compound semiconductors MEMS etc

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